HECT / ICETA
A cascaded solid-state thermoelectric platform that recovers electricity while managing heat. HECT serves industrial and larger heat sources. ICETA brings the same platform into compact thermoelectric towers for chip packages and other high-heat-flux applications.
Standard units scale by quantity, connecting chip-level thermal management with industrial waste-heat recovery and future power systems. The conversion stage uses no turbines, expanders or other high-speed rotating machinery.
Efficiency & Applications
High-temperature design target: 42% net electrical efficiency for the 200–650°C temperature span.
Initial low-temperature validation target: 8% net electrical recovery at 90°C / 30°C, plus 5% of heat allocated to cooling. The corresponding scenario estimates about 8.70% more compute per purchased watt at the same workload.
Applications include AI chips and servers, distributed industrial waste heat, geothermal systems and other heat-to-power installations. The efficiency figures are design targets subject to validation under their respective operating conditions.
Further Technical Discussion
Detailed cascade architecture, engineering structures, materials, contact design and manufacturing parameters can be discussed after signing a non-disclosure agreement (NDA).
How HECT / ICETA Earns Revenue
Semiconductor revenue comes from licensing the thermal-recovery platform to chip and package designers, linked to the rated heat capacity of shipped products.
Industrial waste-heat revenue comes from sharing the value of recovered electricity. Power-supply applications use equipment licenses and continuing equipment royalties. Manufacturing, system integration and installation are performed by industrial partners.
Market Scale
The industrial model uses the US manufacturing waste-heat-to-power technical potential of 14,594 MW reported by ORNL in 2015. The semiconductor model uses serviceable new-shipment capacities of 25, 100, 300 and 500 MW in years 3–6.
The longer-term power-supply scenario uses an approximately 21 GW annual US / European opportunity from new generating capacity and geothermal applications.
Potential customers include NVIDIA, Intel, AMD, Samsung and Google; waste-heat equipment manufacturers; GE Vernova, Westinghouse, Siemens Energy, Mitsubishi Power, Doosan Enerbility and Ansaldo Energia; and geothermal developers and power-plant integrators.
Planned Market Share
Industrial waste heat: 15% cumulative deployment by year 6, equivalent to 2,189.1 MW in the model.
Semiconductor applications: 20% share through direct integration, rising to a 30% scenario with chip co-design.
Longer-term power-supply applications: entry modeled from year 8, targeting 40% of the modeled annual opportunity by year 12, equivalent to approximately 8.4 GW per year.
© 2026 BriLo Energy Inc. All rights reserved.